600V 特点           Tg≥150℃无铅兼容FR-4板材&优秀的耐漏电起痕性CTI>600VUVBlocking/AOI兼容优良的机械加工性能优秀的耐CAF性能应用领域           电脑、仪器仪表、">
+
  • IMG_1722.jpg

RL150&CTI600

主营生产通讯设备、数码家电、电脑等产品之主要电子基础材料:铜箔基板,提供给客户满意的产品选择与售后服务。

所属分类:

产品关键词:

电脑

仪器仪表

摄像机

关键词:

普通FR-4 | 半固化片 | 无铅兼容FR-4 | 无卤兼容FR-4

产品描述

电子资讯工业近几年来在中国的迅速发展下,结合各种相关产业,已经成为中国蓬勃发展、举足轻重的新兴产业。
江苏诺德正是藉此信息产业化发展之平台,以专业制造电子基础材料为优势,于2007年开始建立铜箔基板生产基地,凭借优秀的科技人才与创新的研发能力,配套发展生产通讯设备、数码家电、电脑等产品之主要电子基础材料:铜箔基板,提供给客户满意的产品选择与售后服务。

nuode

RL150&CTI600

 

 

(UL ANSI:FR-4.0)Mid-Tg Lead-Free /UV Blocking/ Excellent resistance to tracking CTI> 600V

 

特点            

  1. Tg ≥150℃无铅兼容FR-4板材&优秀的耐漏电起痕性CTI>600V
  2. UV Blocking/AOI兼容
  3. 优良的机械加工性能
  4. 优秀的耐CAF性能

应用领域            
电脑、仪器仪表、摄像机、通讯设备、
电子游戏机、汽车等

 

 FEATURES     

  1. Tg ≥ 150 ℃ lead-free compatible FR-4 board& Excellent resistance to tracking CTI> 600V
  2. UV Blocking/AOI Compatible
  3. Excellent machinability processability 
  4. Excellent Anti-CAF Performance

 APPLICATIONS     
Computer,lnstrumentation,VCR,communication equipment,electronic game machine,automotive electronics,and etc。

 

GENERAL PROPERTIES    

Test Item

Test condition

Units

Standard value

Typical value

1.Peel Strength , IBS/IN,Minimum,1 OZ

 

IBS/IN

 

 

As received

A

≥8.0

12.6

After thermal stress

A

≥8.0

12.6

2. Volume resistivity ,Minimum
At elevated temperature E-24/125

E-24/125

MΩ.cm  

≥103

≥106

3. Surface resistivity , Minimum                              
At elevated temperature E-24/125        

 E-24/125

≥103

≥106

4.Water absorption , Maximum

E-1/105+des

%

≤0.50

0.13

5.Dielectric Breakdown, Minimum

D-48/50 D-0.5/23

Kv

≥40

43

6. Flexural strength ,Minimum

 

Mpa

 

 

Length direction

A

≥415

520

Cross direction

A

≥345

450

7.Arc resistance ,Minimum

D-48/50
D-0.5/23

S

≥60

140

8.Flammability

A

S

UL-94V0

UL-94V0

9. Permittivity 1MHZ ,Maximum

A

 

≤5.4

4.9

10.Loss tangent 1MHZ ,Maximum

A

---

≤0.035

0.016

11.Thermal stress 288℃,10sec( Minimum )                    

 

---

 

 

Non etched specimen

A

NO DEFECT

NO DEFECT

Etched

A

NO DEFECT

NO DEFECT

12. TG(DSC,℃)

A

≥150

152

13. CTI,V

TEC-112

V

≥600

600

Note:
the treatment of letters and numerical meaning
    A - plate delivery stage
    D - constant temperature water bath E - high temperature baking number 1 / number 2:1 - time (hours) 2 - temperature ( ℃)    des - drying 10 minutes or more or drying condition cooling to room temperature.

                      Warpage of                                                                                Warpage of

                      (No-treating)                                                                               (After treating:125℃ 2hr)

nuode                                           nuode

                       Peel strength

                          nuode

  ※Specimen T hickness:1.6mm single side board

PURCHASING INFORMATION    

 

Thickness

Copper foil

Standard Size

0.2mm  to  3.4mm

12μm  to    105μm

1041×1245mm(41″×49″)    940×1245mm(37″×49″)
1092×1245mm(43″×49″)   

※ Other sheet size and thickness could be available upon request.

 

合作意向表

Cooperation Intent Form